What is the name and formula of the compound commonly used in the manufacture of glass to reduce its tendency to crack or shatter under thermal shock?

Name: Chemistry: A Molecular Approach
Author: Tro
ISBN: 9780134874371

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Identify the compound commonly used in glass manufacturing to improve thermal shock resistance.

Recognize that this compound is often added to glass to enhance its durability and reduce cracking.

Understand that the compound in question is boron oxide, which is used to make borosilicate glass.

Note that borosilicate glass is known for its low thermal expansion and high resistance to thermal shock.

The chemical formula for boron oxide is \( \text{B}_2\text{O}_3 \).

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Thermal Shock

Thermal shock refers to the stress that occurs in materials when they experience rapid temperature changes. This can lead to cracking or shattering, especially in brittle materials like glass. Understanding thermal shock is crucial for selecting materials that can withstand temperature fluctuations without failing.

Silica

Silica, or silicon dioxide (SiO2), is the primary component of glass. It provides the structural framework for glass but can be prone to thermal shock. Modifying silica with other compounds can enhance its thermal stability, making it less likely to crack under temperature changes.

Alumina

Alumina, or aluminum oxide (Al2O3), is often added to glass formulations to improve its thermal and mechanical properties. It increases the glass's resistance to thermal shock and enhances its durability. Understanding the role of alumina in glass manufacturing is essential for producing high-quality glass products.