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Signal and Power Integrity - Simplified, 3rd edition
Published by Pearson (January 2, 2018) © 2018
- Eric Bogatin
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This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching several thousand engineers and graduate students, world-renowned expert Eric Bogatin systematically presents the root causes of all six families of signal integrity, power integrity, and electromagnetic compatibility problems. Bogatin reviews essential principles needed to understand these problems, and shows how to use best design practices and techniques to prevent or address them early in the design cycle. To help test and reinforce your understanding, this new edition adds questions and problems throughout. Bogatin also presents more examples using free tools, plus new content on high-speed serial links, reflecting input from 130+ of his graduate students.
For professionals and students at all levels of experience, this book emphasizes intuitive understanding, practical tools, and engineering discipline, rather than theoretical derivation or mathematical rigor. It has earned a well-deserved reputation as the #1 resource for getting signal integrity designs right—first time, every time.
For professionals and students at all levels of experience, this book emphasizes intuitive understanding, practical tools, and engineering discipline, rather than theoretical derivation or mathematical rigor. It has earned a well-deserved reputation as the #1 resource for getting signal integrity designs right—first time, every time.
- Explains how to make design and technology decisions that ensure reliable power distribution network performance in tomorrow’s faster, smaller devices
- Emphasizes intuitive understanding, practical tools, and engineering discipline, rather than theoretical derivation or mathematical rigor
- Includes new questions and problems designed to help students and professional engineers test and deepen their understanding
- Contains new coverage of using free tools such as QUCS to solve specific problems in signal integrity, power integrity, and electromagnetic compatibility
This Third Edition adds:
More content on high speed serial links in its chapters on differential pairs and lossy lines, including a section on eye diagrams.More examples utilizing free tools, including QUCS, as well as an animation tool for seeing reflections and crosstalk
Chapter-ending questions and problems that make it more suitable as a college textbook and more valuable to engineers
More content on high speed serial links in its chapters on differential pairs and lossy lines, including a section on eye diagrams.More examples utilizing free tools, including QUCS, as well as an animation tool for seeing reflections and crosstalk
Chapter-ending questions and problems that make it more suitable as a college textbook and more valuable to engineers
Preface to the Third Edition    xix
Preface to the Second Edition    xxi
Preface to the First Edition    xxiii
Chapter 1 Signal Integrity Is in Your Future    1
1.1 What Are Signal Integrity, Power Integrity, and Electromagnetic Compatibility?    3
1.2 Signal-Integrity Effects on One Net    7
1.3 Cross Talk    11
1.4 Rail-Collapse Noise    14
1.5Â Electromagnetic Interference (EMI)Â Â Â Â 17
1.6 Two Important Signal-Integrity Generalizations    19
1.7 Trends in Electronic Products    20
1.8 The Need for a New Design Methodology    26
1.9 A New Product Design Methodology    27
1.10 Simulations    29
1.11 Modeling and Models    34
1.12 Creating Circuit Models from Calculation    36
1.13 Three Types of Measurements    42
1.14 The Role of Measurements    45
1.15 The Bottom Line    48
Review Questions    50
Chapter 2 Time and Frequency Domains    51
2.1 The Time Domain    52
2.2 Sine Waves in the Frequency Domain    54
2.3 Shorter Time to a Solution in the Frequency Domain    56
2.4 Sine-Wave Features    58
2.5 The Fourier Transform    60
2.6 The Spectrum of a Repetitive Signal    62
2.7 The Spectrum of an Ideal Square Wave    64
2.8 From the Frequency Domain to the Time Domain    66
2.9 Effect of Bandwidth on Rise Time    68
2.10 Bandwidth and Rise Time    72
2.11 What Does Significant Mean?    73
2.12 Bandwidth of Real Signals    77
2.13 Bandwidth and Clock Frequency    78
2.14 Bandwidth of a Measurement    80
2.15 Bandwidth of a Model    83
2.16 Bandwidth of an Interconnect    85
2.17 The Bottom Line    89
Review Questions    90
Chapter 3 Impedance and Electrical Models    93
3.1 Describing Signal-Integrity Solutions in Terms of Impedance    94
3.2 What Is Impedance?    97
3.3 Real Versus Ideal Circuit Elements    99
3.4 Impedance of an Ideal Resistor in the Time Domain    102
3.5 Impedance of an Ideal Capacitor in the Time Domain    103
3.6 Impedance of an Ideal Inductor in the Time Domain    107
3.7 Impedance in the Frequency Domain    109
3.8 Equivalent Electrical Circuit Models    115
3.9Â Circuit Theory and SPICEÂ Â Â Â 117
3.10 Introduction to Measurement-Based Modeling    121
3.11 The Bottom Line    126
Review Questions    128
Chapter 4 The Physical Basis of Resistance    131
4.1 Translating Physical Design into Electrical Performance    132
4.2 The Only Good Approximation for the Resistance of Interconnects    133
Preface to the Second Edition    xxi
Preface to the First Edition    xxiii
Chapter 1 Signal Integrity Is in Your Future    1
1.1 What Are Signal Integrity, Power Integrity, and Electromagnetic Compatibility?    3
1.2 Signal-Integrity Effects on One Net    7
1.3 Cross Talk    11
1.4 Rail-Collapse Noise    14
1.5Â Electromagnetic Interference (EMI)Â Â Â Â 17
1.6 Two Important Signal-Integrity Generalizations    19
1.7 Trends in Electronic Products    20
1.8 The Need for a New Design Methodology    26
1.9 A New Product Design Methodology    27
1.10 Simulations    29
1.11 Modeling and Models    34
1.12 Creating Circuit Models from Calculation    36
1.13 Three Types of Measurements    42
1.14 The Role of Measurements    45
1.15 The Bottom Line    48
Review Questions    50
Chapter 2 Time and Frequency Domains    51
2.1 The Time Domain    52
2.2 Sine Waves in the Frequency Domain    54
2.3 Shorter Time to a Solution in the Frequency Domain    56
2.4 Sine-Wave Features    58
2.5 The Fourier Transform    60
2.6 The Spectrum of a Repetitive Signal    62
2.7 The Spectrum of an Ideal Square Wave    64
2.8 From the Frequency Domain to the Time Domain    66
2.9 Effect of Bandwidth on Rise Time    68
2.10 Bandwidth and Rise Time    72
2.11 What Does Significant Mean?    73
2.12 Bandwidth of Real Signals    77
2.13 Bandwidth and Clock Frequency    78
2.14 Bandwidth of a Measurement    80
2.15 Bandwidth of a Model    83
2.16 Bandwidth of an Interconnect    85
2.17 The Bottom Line    89
Review Questions    90
Chapter 3 Impedance and Electrical Models    93
3.1 Describing Signal-Integrity Solutions in Terms of Impedance    94
3.2 What Is Impedance?    97
3.3 Real Versus Ideal Circuit Elements    99
3.4 Impedance of an Ideal Resistor in the Time Domain    102
3.5 Impedance of an Ideal Capacitor in the Time Domain    103
3.6 Impedance of an Ideal Inductor in the Time Domain    107
3.7 Impedance in the Frequency Domain    109
3.8 Equivalent Electrical Circuit Models    115
3.9Â Circuit Theory and SPICEÂ Â Â Â 117
3.10 Introduction to Measurement-Based Modeling    121
3.11 The Bottom Line    126
Review Questions    128
Chapter 4 The Physical Basis of Resistance    131
4.1 Translating Physical Design into Electrical Performance    132
4.2 The Only Good Approximation for the Resistance of Interconnects    133
Eric Bogatin received his B.S. in Physics from MIT in 1976 and his M.S. and Ph.D. in Physics from the University of Arizona in Tucson in 1980. For more than 30 years he has been active in the fields of signal integrity and interconnect design. He worked in senior engineering and management roles at AT&T Bell Labs, Raychem Corp, Sun Microsystems, Interconnect Devices Inc., and Teledyne LeCroy. In 2011, his company, Bogatin Enterprises, was acquired by Teledyne LeCroy.
Eric currently is a Signal Integrity Evangelist with Teledyne LeCroy, where he creates and presents educational materials related to new applications for high-performance scopes. Eric turns complexity into practical design and measurement principles, leveraging analysis techniques and measurement tools. Since 2012, he has been an adjunct professor at the University of Colorado in Boulder, teaching graduate courses in signal integrity, interconnect design, and PCB design.
He has written regular monthly columns for PCD&F Magazine, Semiconductor International, Electronic Packaging and Production, Altera Corporation, Mentor Graphics Corporation, EDN, and EE Times. He is currently the editor of the Signal Integrity Journal (www.SignalIntegrityJournal.com )
Eric is a prolific author with more than 300 publications, many posted on his website, www.beTheSignal.com, for download. He regularly presents at DesignCon, the IEEE EMC Symposium, EDI con, and at IPC’s Designer Council events. He is the coauthor of the popular Prentice Hall book, Principles of Power Integrity for PDN Design - Simplified, along with Larry Smith.
He was the recipient of the 2016 Engineer of the Year Award from DesignCon.He can be reached at eric@beTheSignal.com.
Eric currently is a Signal Integrity Evangelist with Teledyne LeCroy, where he creates and presents educational materials related to new applications for high-performance scopes. Eric turns complexity into practical design and measurement principles, leveraging analysis techniques and measurement tools. Since 2012, he has been an adjunct professor at the University of Colorado in Boulder, teaching graduate courses in signal integrity, interconnect design, and PCB design.
He has written regular monthly columns for PCD&F Magazine, Semiconductor International, Electronic Packaging and Production, Altera Corporation, Mentor Graphics Corporation, EDN, and EE Times. He is currently the editor of the Signal Integrity Journal (www.SignalIntegrityJournal.com )
Eric is a prolific author with more than 300 publications, many posted on his website, www.beTheSignal.com, for download. He regularly presents at DesignCon, the IEEE EMC Symposium, EDI con, and at IPC’s Designer Council events. He is the coauthor of the popular Prentice Hall book, Principles of Power Integrity for PDN Design - Simplified, along with Larry Smith.
He was the recipient of the 2016 Engineer of the Year Award from DesignCon.He can be reached at eric@beTheSignal.com.
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