<p>For courses in Micro-Electro-Mechanical Systems (MEMS) taken by advanced undergraduate students, beginning graduate students, and professionals.</p><p><em>Foundations of MEMS</em> is an entry-level text designed to systematically teach the specifics of MEMS to an interdisciplinary audience. Liu discusses designs, materials, and fabrication issues related to the MEMS field by employing concepts from both the electrical and mechanical engineering domains and by incorporating evolving microfabrication technology &mdash; all in a time-efficient and methodical manner. A wealth of examples and problems solidify students&rsquo; understanding of abstract concepts and provide ample opportunities for practicing critical thinking.</p>

<P>Preface to Second Edition<BR>Preface to First Edition<BR>Note to Instructors<BR>About the Author<BR>Notational Conventions</P><P><STRONG>Chapter 1: Introduction<BR></STRONG>1.0. Preview&nbsp;&nbsp;&nbsp;&nbsp;<BR>1.1.&nbsp; The History of MEMS Development&nbsp;&nbsp;&nbsp;&nbsp; <BR>1.1.1. From the Beginning to 1990&nbsp;&nbsp;&nbsp;&nbsp; <BR>1.1.2. From 1990 to 2001&nbsp;&nbsp;&nbsp;&nbsp; <BR>1.1.3. 2002 to present&nbsp;&nbsp;&nbsp;&nbsp; <BR>1.1.4. Future Trends&nbsp;&nbsp;&nbsp;&nbsp; <BR>1.2. The Intrinsic Characteristics of MEMS&nbsp;&nbsp;&nbsp;&nbsp; <BR>1.2.1. Miniaturization&nbsp;&nbsp;&nbsp;&nbsp; <BR>1.2.2. Microelectronics Integration&nbsp;&nbsp;&nbsp;&nbsp; <BR>1.2.3. Parallel Fabrication with Precision&nbsp;&nbsp;&nbsp;&nbsp; <BR>1.3. Devices: Sensors and Actuators&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>1.3.1. Energy Domains and Transducers&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>1.3.2. Sensors Considerations&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>13.3.&nbsp; Sensor Noise and Design Complexity&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>1.3.4. Actuators Considerations&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>Summary&nbsp;&nbsp;&nbsp;<BR>Problems&nbsp;<BR>References&nbsp;</P><P><STRONG>Chapter 2: First-Pass Introduction to Microfabrication&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;</STRONG>&nbsp;&nbsp;&nbsp; <BR>2.0. Preview&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.1. Overview of Microfabrication&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.2. Essential Overview of Frequently Used Microfabrication Processes&nbsp;&nbsp;&nbsp;&nbsp; <BR>2.2.1. Photolithography&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.2.2. Thin film deposition&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.2.3. Thermal oxidation of silicon&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.2.4. Wet Etching&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.2.5. Silicon anisotropic etching&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.2.6. Plasma etching and reactive ion etching&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.2.7. Doping&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.2.8. Wafer dicing&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.2.9. Wafer bonding&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.3. The Microelectronics Fabrication Process Flow&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.4. Silicon-based MEMS Processes&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.5. Packaging and Integration&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.5.1. Integration Options&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.5.2. Encapsulation&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.6. New Materials and Fabrication Processes&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.7. Process Selection and Design&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.7.1. Points of Consideration for Deposition Processes&nbsp;&nbsp;&nbsp;&nbsp; <BR>2.7.2. Points of Consideration for Etching Processes&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.7.3. Ideal Rules for Building a Process Flow&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>2.7.4. Rules for Building a Robust Process&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>Summary&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>Problems&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>References&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; </P><P><STRONG>Chapter 3: Review of Essential Electrical and Mechanical Concepts&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp;</STRONG> <BR>3.0 Preview&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>3.1. Conductivity of Semiconductors&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>3.1.1. Semiconductor Materials&nbsp;&nbsp;&nbsp;&nbsp; &nbsp;&nbsp;&nbsp;&nbsp; <BR>3.1.2. Calculation of Charge Carrier Concentr

<P>For courses in Micro-Electro-Mechanical Systems (MEMS) taken by advanced undergraduate students, beginning graduate students, and professionals.</P><P><I>Foundations of MEMS</I> is an entry-level text designed to systematically teach the specifics of MEMS to an interdisciplinary audience. Liu discusses designs, materials, and fabrication issues related to the MEMS field by employing concepts from both the electrical and mechanical engineering domains and by incorporating evolving microfabrication technology &#151; all in a time-efficient and methodical manner. A wealth of examples and problems solidify students&#146; understanding of abstract concepts and provide ample opportunities for practicing critical thinking.</P>

Chang Liu

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