Introduction to Materials Science for Engineers, Global Edition, 9th edition

1. Materials for Engineering
   • 1.1 The Material World
   • 1.2 Materials Science and Engineering
   • 1.3 Six Materials That Changed Your World
     • STEEL BRIDGES—INTRODUCING METALS
     • TRANSPARENT OXIDES—INTRODUCING CERAMICS
     • SMARTPHONES AND TABLETS—INTRODUCING GLASSES
     • NYLON PARACHUTES—INTRODUCING POLYMERS
     • KEVLAR®-REINFORCED TIRES—INTRODUCINGCOMPOSITES
     • SILICON CHIPS—INTRODUCING SEMICONDUCTORS
   • 1.4 Processing and Selecting Materials
   • 1.5 Looking at Materials by Powers of Ten

PARTI: The Fundamentals

2. Atomic Bonding
   • 2.1 Atomic Structure
   • 2.2 The Ionic Bond
   • COORDINATION NUMBER
   • 2.3 The Covalent Bond
   • 2.4 The Metallic Bond
   • 2.5 The Secondary, or van der Waals, Bond
   • 2.6 Materials—The Bonding Classification

3. Crystalline Structure—Perfection
   • 3.1 Seven Systems and Fourteen Lattices
   • 3.2 Metal Structures
   • 3.3 Ceramic Structures

4. Crystal Defects and Noncrystalline Structure—Imperfection
   • 4.1 The Solid Solution—Chemical Imperfection
   • 4.2 Point Defects—Zero-Dimensional Imperfections
   • 4.3 Linear Defects, or Dislocations—One-Dimensional Imperfections
   • 4.4 Planar Defects—Two-Dimensional Imperfections
   • 4.5 Noncrystalline Solids—Three-Dimensional Imperfections

5. Diffusion
   • 5.1 Thermally Activated Processes
   • 5.2 Thermal Production of Point Defects
   • 5.3 Point Defects and Solid-State Diffusion
   • 5.4 Steady-State Diffusion
   • 5.5 Alternate Diffusion Paths

6. Mechanical Behavior
   • 6.1 Stress Versus Strain
   • METALS
   • CERAMICS AND GLASSES
   • POLYMERS
   • 6.2 Elastic Deformation
   • 6.3 Plastic Deformation
   • 6.4 Hardness
   • 6.5 Creep and Stress Relaxation
   • 6.6 Viscoelastic Deformation
   • INORGANIC GLASSES
   • ORGANIC POLYMERS
   • ELASTOMERS

7. Thermal Behavior
   • 7.1 Heat Capacity
   • 7.2 Thermal Expansion
   • 7.3 Thermal Conductivity
   • 7.4 Thermal Shock

8. Failure Analysis and Prevention
   • 8.1 Impact Energy
   • 8.2 Fracture Toughness
   • 8.3 Fatigue
   • 8.4 Nondestructive Testing
   • 8.5 Failure Analysis and Prevention

9. Phase Diagrams—Equilibrium Microstructural Development
   • 9.1 The Phase Rule
   • 9.2 The Phase Diagram
   • COMPLETE SOLID SOLUTION EUTECTIC DIAGRAM WITH NO SOLID SOLUTION
   • EUTECTIC DIAGRAM WITH LIMITED SOLID SOLUTION
   • EUTECTOID DIAGRAM
   • PERITECTIC DIAGRAM
   • GENERAL BINARY DIAGRAMS
   • 9.3 The Lever Rule
   • 9.4 Microstructural Development During Slow Cooling

10. Time—The Third Dimension
    • 10.1 Time—The Third Dimension
    • 10.2 The TTT Diagram
    • DIFFUSIONAL TRANSFORMATIONS
    • DIFFUSIONLESS (MARTENSITIC) TRANSFORMATIONS
    • HEAT TREATMENT OF STEEL
    • 10.3 Hardenability
    • 10.4 Precipitation Hardening
    • 10.5 Annealing
    • COLD WORK
    • RECOVERY
    • RECRYSTALLIZATION
    • GRAIN GROWTH
    • 10.6 The Kinetics of Phase Transformations for Nonmetals

PART II: Materials and Their Applications

11. Structural Materials—Metals, Ceramics, and Glasses
    • 11.1 Metals
    • FERROUS ALLOYS
    • NONFERROUS ALLOYS
    • 11.2 Ceramics and Glasses
    • CERAMICS—CRYSTALLINE MATERIALS
    • GLASSES—NONCRYSTALLINE MATERIALS
    • GLASS-CERAMICS
    • 11.3 Processing the Structural Materials
    • PROCESSING OF METALS
    • PROCESSING OF CERAMICS AND GLASSES

12. Structural Materials—Polymers and Composites
    • Polymers
    • POLYMERIZATION
    • STRUCTURAL FEATURES OF POLYMERS
    • THERMOPLASTIC POLYMERS
    • THERMOSETTING POLYMERS
    • ADDITIVES
    • 12.2 Composites
    • FIBER-REINFORCED COMPOSITES
    • AGGREGATE COMPOSITES
    • PROPERTY AVERAGING
    • MECHANICAL PROPERTIES OF COMPOSITES
    • 12.3 Processing the Structural Materials
    • PROCESSING OF POLYMERS
    • PROCESSING OF COMPOSITES

13. Electronic Materials
    • 13.1 Charge Carriers and Conduction
    • 13.2 Energy Levels and Energy Bands
    • 13.3 Conductors
    • THERMOCOUPLES
    • SUPERCONDUCTORS
    • 13.4 Insulators
    • FERROELECTRICS
    • PIEZOELECTRICS
    • 13.5 Semiconductors
    • INTRINSIC, ELEMENTAL SEMICONDUCTORS
    • EXTRINSIC, ELEMENTAL SEMICONDUCTORS
    • COMPOUND SEMICONDUCTORS
    • PROCESSING OF SEMICONDUCTORS
    • SEMICONDUCTOR DEVICES
    • 13.6 Composites
    • 13.7 Electrical Classification of Materials

14. Optical and Magnetic Materials
    • 14.1 Optical Materials
    • OPTICAL PROPERTIES
    • OPTICAL SYSTEMS AND DEVICES
    • 14.2 Magnetic Materials
    • FERROMAGNETISM
    • FERRIMAGNETISM
    • METALLIC MAGNETS
    • CERAMIC MAGNETS

15. Materials in Engineering Design
    • 15.1 Material Properties—Engineering Design Parameters
    • 15.2 Selection of Structural Materials—Case Studies
    • MATERIALS FOR HIP- AND KNEE-JOINT REPLACEMENT
    • METAL SUBSTITUTION WITH COMPOSITES
    • 15.3 Selection of Electronic, Optical, and Magnetic Materials—Case Studies
    • LIGHT-EMITTING DIODE
    • GLASS FOR SMART PHONE AND TABLET TOUCHSCREENS
    • AMORPHOUS METAL FOR ELECTRIC-POWERDISTRIBUTION
    • 15.4 Materials and Our Environment
    • ENVIRONMENTAL DEGRADATION OF MATERIALS
    • ENVIRONMENTAL ASPECTS OF DESIGN RECYCLING AND REUSE

• APPENDIX1: Physical and Chemical Data for the Elements
• APPENDIX 2: Atomic and Ionic Radii of the Elements
• APPENDIX 3: Constants and Conversion Factors and the Periodic Table of Elements
• APPENDIX 4: Properties of the Structural Materials
• APPENDIX 5: Properties of the Electronic, Optical, and Magnetic Materials
• APPENDIX 6: Glossary Answers to Practice Problems (PP) and Odd-Numbered Problems Index